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Arctic Silver Arcticlean Thermal Cooling Material Remover and Surface Purifier (ACN-60ML)

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Out of stock


  • 2-step cleaning process
  • Removes existing thermal grease or pads
  • Prepares surface for fresh applications

QAR 79

Out of stock

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BrandArctic Silver 5
Model nameASCAN-60ML-R
Item dimensions LxWxH16.5 x 10.8 x 1.9 centimeters
Item weight0.1 Pounds

Arctic Cooling Arcticlean Thermal Material Remover & Surface Purifier 60ml Kit ACN-60ML

ArctiClean is a 2-step cleaning process that removes existing thermal grease or pads and prepares the thermal surface for a fresh application of thermal interface material. The ArctiClean 1 thermal material remover quickly emulsifies and dissolves thermal grease or pads from CPU or heatsink surfaces. A few drops of ArctiClean 2 thermal surface purifier and some gentle wiping then removes the remaining residue and inhibits flash corrosion on copper or aluminum.

Unique 2-Step Process:
ArctiClean 1 Thermal Material Remover quickly emulsifies and dissolves the existing thermal grease or pad from the CPU and/or heatsink so that it can easily be removed with a clean cloth or paper towel. A few drops of ArctiClean 2 Thermal Surface Purifier and some gentle wiping then removes the remaining residue and inhibits flash corrosion on copper or aluminum.

ArctiClean 1 Thermal Material Remover:
ArctiClean 1 uses a proprietary combination of non-toxic biodegradable solvents to emulsify thermal greases or thermal pads. The citrus and soy based solvents in ArctiClean 1 match or exceed many hazardous and volatile solvents such as fluorinated and chlorinated organic solvents, acetone, MEK (methyl ethyl ketone), mineral spirits, isopropyl alcohol, and toluene.

ArctiClean 2 Thermal Surface Purifier:
The cationic surfactants in ArctiClean 2 remove any residue left by the ArctiClean 1 leaving a pristine surface for the application of a new thermal interface material. It also incorporates advanced flash corrosion inhibitors that minimize the corrosion layer on copper and aluminum allowing for more intimate contact between the thermal interface material and the heatsink.

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